INTERACT: The First Workshop on Communication and Networking for TinyML based Consumer Applications

In conjunction with ACM/IEEE Symposium on Edge Computing (SEC 2024), 4-7 December 2024 // Rome, Italy

Call for Papers

The INTERACT workshop focuses on a cutting-edge area at the intersection of Machine Learning (ML), the Internet of Things (IoT), and communication networks. This field is specifically concerned with developing and optimizing techniques for deploying and operating TinyML on IoT devices used in consumer applications while ensuring seamless communication and networking. 


The main challenges in this field involve handling the trade-off between resource usage (battery life, data usage) and maintaining high levels of performance and reliability in the machine learning models and communication protocols. This includes optimizing power- efficient algorithms, creating robust low-power communication protocols, managing networks of devices, and ensuring reliable and timely data transfer. 


In summary, INTERACT focuses on an exciting and challenging field of research that has the potential to significantly impact the way we interact with technology in our daily lives. Edge computing concepts are critical to this research area. By processing data closer to where it is generated, TinyML can significantly enhance the responsiveness and efficiency of IoT systems, particularly in environments with limited connectivity. This approach minimizes latency, reduces bandwidth use, and further optimizes the operation of TinyML on consumer devices, making it a critical component in the evolution of intelligent technologies.


Topics of interests

  •  Efficient Communication Protocols for TinyML
  •  Network Management for TinyML Devices
  •  Data Compression in TinyML
  •  Security and Privacy in TinyML Networks
  •  Edge Computing in TinyML Applications
  •  Energy Harvesting for Sustainable TinyML
  •  Real-time Processing in TinyML
  •  Integration of 5G/6G in TinyML Applications
  •  Federated Learning for TinyML
  •  Case Studies of TinyML in Consumer Applications

Submission Guidelines

Only electronic submissions in PDF will be accepted. Submitted papers must be written in English and must render without error using standard PDF viewing tools. Submitted papers must be no longer than 6 single-spaced 8.5" x 11" pages, including figures and tables, but excluding references, and using 10-point type on 12-point (single-spaced) leading, two-column format, Times Roman, or a similar font, within a text block 7.14" wide x 9.22" deep. IEEE Standard template for Latex and Word meet these specifications and can be found at:

https://www.ieee.org/conferences/publishing/templates.html


Papers not meeting these criteria will be rejected without review, and no deadline extensions will be granted for reformatting. Pages should be numbered, and figures and tables should be legible in black and white, without requiring magnification.


Submission website: https://interact2024.hotcrp.com/


Important Dates

 Submissions deadline: August 18, 2024

 Notification of acceptance: October 25, 2024

 Camera-ready papers due: November 1, 2024

 Workshops date: (to be confirmed)


Organizing Committee

General co-Chairs

Carlos Tavares Calafate, Universitat Politècnica de València, Spain

Pietro Manzoni, Universitat Politècnica de València, Spain


TPC co-Chairs

Claudio Savaglio, University of Calabria, Italy

Marco Zennaro, The Abdus Salam International Centre for Theoretical Physics (ICTP), Italy


Technical Programm Committee (to be confirmed)

Atakan Aral, Umeå Universitet, Sweden

Dejan Vukobratovic, University of Novi Sad, Serbia

Elena Simona, Lohan, Tampere University, Finland

Giovanni Delnevo, University of Bologna, Italy

Jamie Wubben, Technical University of Valencia, Spain

Laila Kazimierski, CONICET, Argentina

Marcelo Rovai, UNIFEI - Federal University of Itajubá, Brazil

Michele Magno, ETH Zurich, Switzerland

Milan Lukic, University of Novi Sad, Serbia

Roberto Morabito, Eurecom, France

Rute Sofia, fortiss, Germany

SiYoung Jang, Nokia Bell Labs, United Kingdom

Slavisa Tomic, Universidade Lusófona, Portugal

Thomas Basikolo, International Telecommunication Union, Switzerland